Building on her work with lithography and OLED characterization at HP Labs, Dr. Sheats envisioned a process whereby the mechanical mechanism of Pick & Place dominant in circuit assembly could be replaced by a chemical-based process.

Candidate polymers suitable for the device transfer application were first synthesized and tested at the University of Toronto in 2005.  Between 25 and 50 distinct compositions of polymer and photoacid generator were investigated over a 2-year period before arriving at one which had suitable properties.

Dr. Sheats co-founded her first startup, Terepac, in 2008 and over the next several years succeeded in developing a roll-to-roll process for manufacturing multi-chip integrated RFID-type inlays for Internet of Things (IoT) / Smart Card products.  By the end of 2013, the fundamental process had been successfully demonstrated in a commercial production setting, proving that the desired lift-and-release capability of the material functioned in a production tool.  

By 2015, Dr. Sheats realized that circuit design trends (smaller, lighter, thinner, flexible, hybrid) and the diminishing cost/benefit returns of semiconductor scaling (Moore’s Law) were combining to obsolete the dominant packaging &  assembly tools and processes.  Terecircuits was founded to develop the Photo-Polymer Mass Transfer process and meet the challenges of  building the next generation of products: collectively known as Industry 4.0.

Today at Terecircuits, we work with industrial tool partners and their OEMs to solve circuit assembly challenges by developing novel materials and processes at the boundary of what is possible.  In addition to continued work on advanced polymers, our IP portfolio includes encapsulation materials and liquid metal interconnects for the “More than Moore” generation of products.